Swagelok® IGC® II Integrated Gas Components
1.5 in (38.1 mm) C-Ring Modular Design for Ultrahigh-Purity (UHP) Systems
The Swagelok IGC II system consists of lightweight, easy-to-assemble components and standard hardware that can be customized for any flow configuration.Ultrahigh-purity processing in accordance with Swagelok SC-01 is standard for substrate and manifold components. The IGC II System Configurator simplifies the layout, selection, and ordering of IGC II integrated gas system components.

Substrate/Manifold Specifications •  Pressure Rating    at 70°F (20°C) •  Temperature Rating •  Wetted Materials •  Internal Surface Finish

3000 psig (206 bar) 248°F (120°C) operating 302°F (150°C) bakeout 316L VIM-VAR stainless steel 5 µin. (0.13 µm) Ra

A typical IGC II system consists of three layers—a substrate assembly, a manifold assembly, and mounting components.

• The substrate assembly provides the flow path for the process gas through the gas stick.
• The manifold assembly provides the flow path between two or more parallel gas sticks.
• The substrate-manifold assembly accepts any 1.5 in. (38.1 mm) C-ring surface-mount component.

A conversion plate provides the mounting capacity for a mass flow controller, and a tube port is available to provide a 1/4 in. vertical tube port on a manifold or substrate.

Swagelok Surface-Mount Components